PCB Design Services

PCB (Printed Circuit Board) design is the process of creating a layout for electronic components and their interconnections on a board to form a functional circuit. It involves schematic design, component placement, routing, and preparing files for manufacturing.

• Schematic accuracy: Ensure the schematic matches the intended circuit.
• Component placement: Optimize for signal flow, thermal management, and manufacturability.
• Routing: Minimize trace lengths, avoid crosstalk, and maintain signal integrity.
• Power and ground planes: Use for stable power distribution and noise reduction.
• Design Rule Checks (DRC): Verify against manufacturer’s specs (trace width, clearances, etc.).
• Thermal management: Account for heat dissipation.
• EMI/EMC: Minimize electromagnetic interference.

There are many software applications for PCB design. EMS uses Altium Designer.

• Single-layer: Conductive paths on one side; simple, low-cost, used for basic circuits.
• Double-layer: Conductive paths on both sides.
• Multilayer: Multiple conductive layers; complex, used for high-density designs like smartphones or computers.

• FR4: Standard for most applications, cost-effective.
• High-frequency: Rogers, Teflon for RF/microwave.
• Flex PCBs: Polyimide for flexible designs.
• Metal-core: Aluminum for heat dissipation (e.g., in LEDs). Consider frequency, thermal needs, and mechanical requirements.

• Incorrect footprint sizes.
• Inadequate trace widths for current.
• Poor grounding (e.g., ground loops, star grounding issues).
• Ignoring via placement and types (through-hole, blind vias).
• Neglecting DFM (Design for Manufacturability) guidelines.

DFM ensures the PCB can be manufactured reliably and cost-effectively. It includes:

• Following manufacturer’s design rules (e.g., minimum trace width, via size).
• Avoiding complex features that increase costs.
• Ensuring clear silkscreen and proper component spacing.

Vias are conductive holes connecting layers:

• Through-hole vias: Pass through all layers.
• Blind vias: Connect outer to inner layers.
• Buried vias: Connect inner layers only.
• Microvias: Small, used in high-density designs.

• Simulation: Use SPICE or signal integrity tools.
• DRC/ERC: Run Design/ Electrical Rule Checks in software.
• Prototyping: Build and test a physical board.
• Continuity testing: Check for shorts/opens.
• Functional testing: Verify circuit operation.

Gerber files are industry-standard files sent to manufacturers, defining:

• Copper layers.
• Solder mask.
• Silkscreen.
• Drill holes. Generated by PCB design software.

Impedance control ensures consistent signal integrity for high-speed signals (e.g., USB, HDMI). It involves:

• Specific trace width/spacing.
• Controlled dielectric thickness.
• Matching to standards (e.g., 50Ω single-ended, 100Ω differential).